|
Introduction of DIP process flow in PCBA processing In PCBA processing, with SMT technology becoming more and more accurate, PCB and electronic components becoming smaller and smaller, SMT processing becomes more and more popular. SMT processing gradually replaces the previous DIP processing, but some circuit boards still need DIP processing. DIP processing is still very common in the current electronic industry. Dual In-line Package,Also known as DIP packaging, also known as dual in-line packaging technology, refers to integrated circuit chips that adopt dual in-line packaging. Most small and medium-sized integrated circuits adopt this packaging form, and the number of pins generally does not exceed 100.
1.Check BOM and process scheduling Collect materials according to the BOM bill of materials, check the material model and specification, and then schedule the process, and assign components to each work position. 2. DIP Insert the components that need to pass holes into the corresponding positions of the PCB board to prepare for wave soldering. 3.Wave soldering Put the PCBA into the wave soldering conveyor belt and complete the wave soldering of the PCBA through spraying flux, preheating, wave soldering and cooling. 4. Repair Repair defective PCBA. 5.Clean Clean the flux and other harmful substances left on the finished PCBA products to meet the environmental standard cleanliness required by customers. 6.PCBA test After the completion of PCBA, it is necessary to carry out functional test to test whether all functions are normal and ensure that all PCBA delivered to customers are qualified. |
