4 layers GSM Circuit Board
| Item | Capability | | Number of Layers | 4 layer | | Material | FR4 | | PCB Thickness | 1.0mm | | Copper Thickness | 1/1/1/1 OZ | | Max Finish size | 580X610mm | | Min. Hole size | Min: 0.2mm and max 6.5mm | | Min trace/space | H/H oz 3/3mil; 1/1 oz 4/4mil; | | Finishing | ENIG | | SolderMask | Green | | PeelableMask | Thickness≥ 0.3mm | | Outline profile | CNC Routing. V-CUT. | | Tolerance | Outline: ± 0.1mm/NPTH: ± 0.05mm/PTH/Hole position: ± 0.075mm/V-CUT: ± 0.1mm | | Min Registration between layers | ± 3mil(± 0.076mm) | | Twist and Bow | Follow IPC-A-600G Spec: 0.7%{max} | | Testing | Impedance testing Open/short testing/Universal testing/Flying-prob |
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